Title:
容量性レンズを含む指センサ及びこれに関連する方法
Document Type and Number:
Japanese Patent JP2013531778
Kind Code:
A
Abstract:
A finger sensing device may include a mounting substrate, an integrated circuit (IC) die carried by the mounting substrate and having an array of electric field-based finger sensing elements, and first electrical connections coupling the mounting substrate and the IC die. In addition, the finger sensing device may include a protective plate attached over the array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for the array of electric field-based finger sensing elements. The finger sensing device may also include an encapsulating material adjacent the mounting substrate and the IC die and around at least the first electrical connections.
Inventors:
Giovanni Gozzini
Robert Henry Bond
Robert Henry Bond
Application Number:
JP2013505132A
Publication Date:
August 08, 2013
Filing Date:
April 14, 2011
Export Citation:
Assignee:
Authentic, Inc.
International Classes:
G01B7/28; G06F3/041; G06F3/044
Domestic Patent References:
| JP2001222706A | 2001-08-17 | |||
| JP2002502517A | 2002-01-22 | |||
| JP2002297317A | 2002-10-11 | |||
| JP2003058872A | 2003-02-28 | |||
| JP2003083708A | 2003-03-19 | |||
| JP2011530113A | 2011-12-15 | |||
| JP2001060261A | 2001-03-06 | |||
| JP2006158976A | 2006-06-22 | |||
| JP2006286009A | 2006-10-19 | |||
| JP2001222706A | 2001-08-17 | |||
| JP2002502517A | 2002-01-22 | |||
| JP2002297317A | 2002-10-11 | |||
| JP2003058872A | 2003-02-28 | |||
| JP2003083708A | 2003-03-19 | |||
| JP2011530113A | 2011-12-15 |
Foreign References:
| US7272723B1 | 2007-09-18 | |||
| WO2010014683A2 | 2010-02-04 | |||
| US7272723B1 | 2007-09-18 |
Attorney, Agent or Firm:
Kenji Sugimura
Groundwork Kenichi
Tsubouchi Shin
Groundwork Kenichi
Tsubouchi Shin