Title:
高い衝撃靱性のはんだ合金
Document Type and Number:
Japanese Patent JP2014524354
Kind Code:
A
Abstract:
A lead-free solder alloy, comprising: from 35 to 59 %wt Bi; from 0.01 to 0.5 %wt Ni; one or both of: from 0.05 to 1.0 %wt Cu, and from 0.01 to 1.0 wt% Ag; from 0 to 1.0 %wt Sb; and the balance Sn, together with any unavoidable impurities being not more than 1.0 wt.%.
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Inventors:
Ranjit Pander
バーワ Singh
シウリ sir car
スジャータ Choi Goody
Anil Kay N Kumar
カマニオ chat パディヤイ
Dominick lodge
モルガーナ de Avila ヒバス
バーワ Singh
シウリ sir car
スジャータ Choi Goody
Anil Kay N Kumar
カマニオ chat パディヤイ
Dominick lodge
モルガーナ de Avila ヒバス
Application Number:
JP2014523397A
Publication Date:
September 22, 2014
Filing Date:
August 02, 2012
Export Citation:
Assignee:
Alpha Metals, Incorporated Alpha Metals and Inc.
International Classes:
B23K35/26; B23K1/00; C22C12/00; C22C13/02; H05K3/34; B23K101/42
Domestic Patent References:
| JPH08224689A | 1996-09-03 | |||
| JP2000079494A | 2000-03-21 | |||
| JP2002178191A | 2002-06-25 | |||
| JP2004017093A | 2004-01-22 | |||
| JP2008284583A | 2008-11-27 | |||
| JP2003290974A | 2003-10-14 | |||
| JP2009101415A | 2009-05-14 | |||
| JP2000141079A | 2000-05-23 | |||
| JPH11221693A | 1999-08-17 | |||
| JPH1133775A | 1999-02-09 | |||
| JP2001179483A | 2001-07-03 | |||
| JP2001298270A | 2001-10-26 | |||
| JP2010029868A | 2010-02-12 | |||
| JP2007536088A | 2007-12-13 |
Foreign References:
| CN101392337A | 2009-03-25 | |||
| CN101301705A | 2008-11-12 | |||
| CN102029479A | 2011-04-27 | |||
| US5569433A | 1996-10-29 | |||
| US5833921A | 1998-11-10 |
Attorney, Agent or Firm:
Yamada Takuji
On a word Keiichi
Yamao 憲人
On a word Keiichi
Yamao 憲人