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Title:
LOOP-TYPE HEAT PIPE AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2015087089
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To prevent variation in cooling performance of a loop-type heat pipe, in the loop-type heat pipe and electronic equipment.SOLUTION: The loop-type heat pipe has an evaporator 21 for vaporizing a working fluid C, a condenser 3 for liquefying the working fluid C, and a steam pipe 4 and a liquid pipe 5 connecting the evaporator 21 and the condenser 3 together to form a loop. The evaporator 21 has a container 22 including an inner bottom surface 22a, a wick 23 which is disposed in the container 22 while separating upward from the inner bottom surface 22a, and which forms a space S for accumulating the vapor Cv of the working fluid C in cooperation with the inner bottom surface 22 and into which the working fluid C sinks, and a plurality of fins 24 which are disposed on the inner bottom surface 22a so as to come in contact with a part of the wick 23 from below, and which suck the working fluid C having sunk in the wick 23.

Inventors:
SHIOGA KENJI
MIZUNO YOSHIHIRO
Application Number:
JP2013228401A
Publication Date:
May 07, 2015
Filing Date:
November 01, 2013
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
F28D15/02; H01L23/427
Domestic Patent References:
JP2008281229A2008-11-20
JP2012193912A2012-10-11
JP2007093020A2007-04-12
Foreign References:
US20070056714A12007-03-15
Attorney, Agent or Firm:
Keizo Okamoto