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Title:
電解槽用接触片
Document Type and Number:
Japanese Patent JP2015530480
Kind Code:
A
Abstract:
本発明は電解槽用接触片に関し、接触片は、物理的気相成長法によって、バナジウムを０〜１０質量％含有するニッケル層で被覆されたチタン片からなる。【選択図】図１

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Inventors:
Hallman, Dirk
Donst, Dimitri
Porsin, Gregor
Frank, Frank
Voltering, Peter
Tros, peter
Hoffman, Philip
Application Number:
JP2015525807A
Publication Date:
October 15, 2015
Filing Date:
July 23, 2013
Export Citation:
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Assignee:
Udenola Sochieta Pell Azioni
International Classes:
C23C14/14; C23C14/16; C25B9/04
Domestic Patent References:
JP2010511787A2010-04-15
JP2012508822A2012-04-12
JP2003520297A2003-07-02
Foreign References:
US20040081881A12004-04-29
Other References:
"NIV7 FOR SEMICONDUCTOR APPLICATIONS", [ONLINE], JPN5015011008, 15 October 2008 (2008-10-15), pages 1 - 4, ISSN: 0003603734
Attorney, Agent or Firm:
Shinjiro Ono
Yasushi Kobayashi
Shigeo Takeuchi
Osamu Yamamoto
Shigeru Sakuma



 
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