Title:
高密度用ローカルインターコネクト構造
Document Type and Number:
Japanese Patent JP2016507909
Kind Code:
A
Abstract:
拡散方向のローカルインターコネクトを介して隣接するゲート層に結合されたゲート方向のローカルインターコネクトを含むローカルインターコネクト構造が提供される。
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Inventors:
John Jiang Hongs
Giridar Narapatty
Pull Chidam Balam
Giridar Narapatty
Pull Chidam Balam
Application Number:
JP2015559322A
Publication Date:
March 10, 2016
Filing Date:
March 11, 2014
Export Citation:
Assignee:
Qualcomm, Inc.
International Classes:
H01L21/8234; H01L21/768; H01L21/8238; H01L27/08; H01L27/088; H01L27/092
Domestic Patent References:
| JP2010074158A | 2010-04-02 | |||
| JP2003243531A | 2003-08-29 | |||
| JP2001127169A | 2001-05-11 | |||
| JP2010212531A | 2010-09-24 | |||
| JP2011228645A | 2011-11-10 | |||
| JP2008118004A | 2008-05-22 | |||
| JP2009267094A | 2009-11-12 | |||
| JP2010074158A | 2010-04-02 | |||
| JP2003243531A | 2003-08-29 | |||
| JP2001127169A | 2001-05-11 | |||
| JP2010212531A | 2010-09-24 | |||
| JP2011228645A | 2011-11-10 | |||
| JP2008118004A | 2008-05-22 | |||
| JP2009267094A | 2009-11-12 |
Foreign References:
| US4570176A | 1986-02-11 | |||
| US4570176A | 1986-02-11 |
Attorney, Agent or Firm:
Yasuhiko Murayama
Kuroda Shinpei
Kuroda Shinpei