Title:
POWDER METAL INJECTION MOLDING COMPOUND, METAL POWDER MOLDING, MANUFACTURING METHOD FOR SINTERED BODY, AND SINTERED BODY
Document Type and Number:
Japanese Patent JP2018145481
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sintered body satisfying a plurality of different characteristics, and a manufacturing method for the sintered body capable of manufacturing the sintered body, a metal powder injection molding compound and a metal powder molding.SOLUTION: A metal powder injection molding compound includes: secondary particles 2 in which first metal particles 21 are bound with one another; and a matrix region 3 including second metal particles 31 having constituent materials different from those of the first metal particles 21 and a binder 32. The secondary particles 2 are preferably formed by binding first metal particles 21 with one another via the binder 32 or by fastening the first metal particles 2 with one another. A mean particle diameter of the second metal particles 31 is preferably smaller than a mean particle diameter of the first metal particles 21 in the metal powder injection molding compound. The secondary particles are preferably dispersed in the matrix region 3 in the metal powder injection molding compound.SELECTED DRAWING: Figure 2
Inventors:
NAKAMURA HIDEFUMI
HIDESHIMA YASUTOSHI
HIDESHIMA YASUTOSHI
Application Number:
JP2017042093A
Publication Date:
September 20, 2018
Filing Date:
March 06, 2017
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
B22F3/02; B22F1/102; B22F1/107; B22F1/103; B22F1/148
Domestic Patent References:
| JP2004292878A | 2004-10-21 | |||
| JP2004124119A | 2004-04-22 | |||
| JPH1143373A | 1999-02-16 | |||
| JP2009542463A | 2009-12-03 |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi