Title:
PACKAGING STRUCTURE WITH EXCELLENT REPAIRABILITY
Document Type and Number:
Japanese Patent JP2018181937
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a packaging structure with excellent repairability.SOLUTION: A packaging structure of a semiconductor package component comprises: a plural number of first electrodes; a semiconductor package component having the plural number of first electrodes; a plural number of second electrodes; and a circuit board having the plural number of second electrodes. An electrode bump is arranged on each first electrode, and a bonding member is arranged on each second electrode. A resin member is arranged in the circumference of the bonding member. The electrode bump is electrically connected with the bonding member. Thus, each first electrode and each second electrode are electrically connected. The bonding member and the resin member form a bonding part bonding the electrode bump and each second electrode. A wetting height of the resin member arranged in the circumference of the bonding member satisfies the following equation: (outside wetting height)≤(inside wetting height)×0.8.SELECTED DRAWING: Figure 1A
Inventors:
OHASHI NAOMICHI
SUZUKI YASUHIRO
HINO HIROHISA
SUZUKI YASUHIRO
HINO HIROHISA
Application Number:
JP2017075403A
Publication Date:
November 15, 2018
Filing Date:
April 05, 2017
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
H01L21/60; H05K3/28; H05K3/32; H05K3/34
Attorney, Agent or Firm:
Samejima Mutsumi
Yoshida Tamaki
Yoshida Tamaki