Title:
ADHESIVE COMPOSITION, SUPPORT WITH ADHESION LAYER, ADHESIVE FILM, LAMINATE AND METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2018188613
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive composition for bonding a support and a substrate together, the adhesive composition making it possible to form an adhesion layer having improved heat resistance, and provide a support with an adhesion layer, an adhesive film, a laminate and a method for producing the same, and a method for producing an electronic component, employing the same.SOLUTION: An adhesive composition for bonding a support 12 and a substrate 4 together, contains a hydrocarbon resin (P1), and a resin (P2) with a glass transition temperature of 180°C or more (excluding the hydrocarbon resin (P1)), as resin components (P).SELECTED DRAWING: Figure 1
Inventors:
YOSHIOKA TAKAHIRO
IMAI HIROFUMI
IMAI HIROFUMI
Application Number:
JP2017239885A
Publication Date:
November 29, 2018
Filing Date:
December 14, 2017
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
C09J125/02; B32B27/00; B32B27/32; C09J4/02; C09J7/20; C09J11/06; C09J179/04
Domestic Patent References:
| JP2011026548A | 2011-02-10 | |||
| JP2010024435A | 2010-02-04 | |||
| JPH0463810A | 1992-02-28 | |||
| JP2013049739A | 2013-03-14 |
Attorney, Agent or Firm:
Sumio Tanai
Matsumoto
Ryu Miyamoto
Masato Iida
Matsumoto
Ryu Miyamoto
Masato Iida