Title:
REPLENISHMENT METHOD AND REPLENISHMENT APPARATUS OF METALLIC IONS FOR PLATING
Document Type and Number:
Japanese Patent JP2019002040
Kind Code:
A
Abstract:
To provide a replenishment method of metallic ions for plating that can increase the dissolution speed of a metal for plating into plating solution without using highly concentrated oxygen gas pressurized or in a pressure vessel.SOLUTION: A replenishment method of the present invention is a method in which metallic ions are replenished into plating solution 3 to be used for electroplating equipment. The plating solution 3 is supplied into a metal-pieces accommodation tank 2 filled with a plurality of metal pieces 9 inside, and is spread into the gaps of the metal pieces 9. An air 7 is supplied into the gaps, in which the plating solution is spread, so that the air 7 flows through the gaps.SELECTED DRAWING: Figure 4
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Inventors:
NISHIDE YUKIAKI
INOUE HARUKI
ISHIKAWA KAZUAKI
TSUJIMURA TAKAO
INOUE HARUKI
ISHIKAWA KAZUAKI
TSUJIMURA TAKAO
Application Number:
JP2017117128A
Publication Date:
January 10, 2019
Filing Date:
June 14, 2017
Export Citation:
Assignee:
NISSHIN STEEL CO LTD
International Classes:
C25D21/14
Domestic Patent References:
| JP2009041070A | 2009-02-26 | |||
| JPH0397887A | 1991-04-23 | |||
| JP2017190485A | 2017-10-19 | |||
| JP2013216932A | 2013-10-24 |
Attorney, Agent or Firm:
Hirohiro Naya
Yuko Hirata
Yuko Hirata