Title:
SENSOR DEVICE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2019002838
Kind Code:
A
Abstract:
To suppress influence on characteristics of a sensor element by a die bond resin for fixing the sensor element to a package.SOLUTION: A sensor device 1A includes: a package 20 including a base 21 and an introduction hole 22 penetrating into the base; a sensor element 10 which includes a diaphram 11 covering the introduction hole and a leg 12 protruding from an outer edge of the diaphram toward the base; and a fixing member 30 which fixes the leg to the package, and which is made of a die bond resin. An inner end 12a of the leg is located inside an inner end 23a of a fixed part 23 at which the leg is fixed in a package in a direction orthogonal to a central axis O of the introduction hole.SELECTED DRAWING: Figure 1
Inventors:
TAKAYAMA NAOKI
Application Number:
JP2017118794A
Publication Date:
January 10, 2019
Filing Date:
June 16, 2017
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
G01L9/00; B81B7/02; B81C3/00; H01L29/84
Attorney, Agent or Firm:
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu