Title:
THROUGH ELECTRODE SUBSTRATE
Document Type and Number:
Japanese Patent JP2019004122
Kind Code:
A
Abstract:
To provide a through electrode substrate capable of preventing a trouble such as fracture or a crack or the like in a first insulation layer.SOLUTION: A through electrode substrate comprises: a substrate including a first surface and a second surface on the side opposite to the first surface; a through electrode conducting the first surface and the second surface; a first conductive layer arranged on the first surface of the substrate; a first insulation layer arranged on the first conductive layer; a second conductive layer arranged on the first insulation layer; a resin layer arranged so as to cover the first conductive layer, the first insulation layer, and the second conductive layer; and a connection hole formed at the position corresponding to the second conductive layer of the resin layer. The connection hole includes a first portion having a prescribed shape in a plan view, and at least one second portion protruding in a direction crossing a penetration direction of the connection hole from the first portion.SELECTED DRAWING: Figure 3
Inventors:
OKUNO SHIGERU
KURAMOCHI SATORU
KURAMOCHI SATORU
Application Number:
JP2017120171A
Publication Date:
January 10, 2019
Filing Date:
June 20, 2017
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/12; H05K1/02; H05K1/11; H05K3/46
Attorney, Agent or Firm:
Hiraki International Patent Office