Title:
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF
Document Type and Number:
Japanese Patent JP2019009359
Kind Code:
A
Abstract:
To provide a multilayer ceramic electronic component with a metal terminal capable of being surely welded and mounted even when a mounting board is warped or a connecting portion is not in one plane due to a step difference, and a mounting structure thereof.SOLUTION: A first metal terminal includes a first terminal joining portion connected to the first end surface, a first extension portion connected to the first terminal joining portion and extending in the direction of the mounting face, a first mounting portion connected to the first extension portion and extending in the length direction connecting the first end surface and the second end surface. A second metal terminal includes a second terminal joining portion connected to the second end surface, a second extension portion extending from the second terminal joining portion in the direction of the mounting surface, and a second mounting portion connected to the second extension portion and extending in the length direction connecting the first end surface and the second end surface. A first convex portion and a second convex portion protruding toward the mounting surface are provided on both end sides connecting the first side surface and the second side surface of the first mounting portion, and the second mounting portion is provided with a third convex portion protruding toward the mounting surface side.SELECTED DRAWING: Figure 1
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Inventors:
AKIYOSHI TEPPEI
Application Number:
JP2017125647A
Publication Date:
January 17, 2019
Filing Date:
June 27, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G4/30; H01G4/232
Attorney, Agent or Firm:
Masahiro Okada
Ichi Ogiya
Ichi Ogiya