Title:
WAFER PROCESSING METHOD
Document Type and Number:
Japanese Patent JP2019022920
Kind Code:
A
Abstract:
To provide a wafer processing method that can suppress dispersion between a polishing rate when processing the first wafer after idling operation and a polishing rate during continuous processing of wafers.SOLUTION: The wafer processing method comprises at least: an idling step ST1 of driving a polishing unit of a grinding/polishing device; and a grinding/polishing step ST2 of polishing with a polishing pad wafers held on a chuck table of the grinding/polishing device after executing the idling step ST1. As polishing conditions in the grinding/polishing step ST2, two kinds are specified including: an inclination of a rotary shaft during initial processing of polishing a first wafer; and an inclination of the rotary shaft during continuous processing of polishing a second and subsequent wafers. The inclination of the rotary shaft during the initial processing is set so that a polishing rate when polishing the first wafer at the inclination of the rotary shaft during the initial processing becomes identical to a polishing rate thereof when polishing the second and subsequent wafers at the inclination of the rotary shaft during the continuous processing.SELECTED DRAWING: Figure 9
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Inventors:
TAKEKAWA MASAHIRO
SHIRAHAMA TOMOHIRO
SHIRAHAMA TOMOHIRO
Application Number:
JP2017142909A
Publication Date:
February 14, 2019
Filing Date:
July 24, 2017
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B49/05; B24B7/04; B24B41/06; H01L21/304
Domestic Patent References:
| JP2009302577A | 2009-12-24 | |||
| JPH023354U | 1990-01-10 | |||
| JP2013119123A | 2013-06-17 | |||
| JP2013193156A | 2013-09-30 | |||
| JP2017019067A | 2017-01-26 | |||
| JP2000301440A | 2000-10-31 | |||
| JP2009241233A | 2009-10-22 |
Foreign References:
| US6514861B1 | 2003-02-04 |
Attorney, Agent or Firm:
Sakai International Patent Office