Title:
WORK PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2019022936
Kind Code:
A
Abstract:
To provide a work processing device that can stably perform accurate cutting process in a ductile mode without generating a crack or breakage even for a work that is constituted of a brittle-material.SOLUTION: A work processing device includes a blade processing part 302 that removes and regenerates a cutting edge at a surface of a blade 26 that is constituted of a polycrystalline diamond 26a with electrical discharge processing using water.SELECTED DRAWING: Figure 28
Inventors:
IZUMI YASUO
MINAMI HISASHI
WATANABE KOJI
YANAGIDA DAISUKE
FUJITA TAKASHI
WATANABE JUNJI
MINAMI HISASHI
WATANABE KOJI
YANAGIDA DAISUKE
FUJITA TAKASHI
WATANABE JUNJI
Application Number:
JP2018166920A
Publication Date:
February 14, 2019
Filing Date:
September 06, 2018
Export Citation:
Assignee:
SHIN NIHON TECH INC
TOKYO SEIMITSU CO LTD
OSAKA RES INST IND SCIENCE & TECH
TOKYO SEIMITSU CO LTD
OSAKA RES INST IND SCIENCE & TECH
International Classes:
B24B53/00; B23H1/00; B24B27/06; H01L21/301
Domestic Patent References:
| JP2002261049A | 2002-09-13 | |||
| JP2014046530A | 2014-03-17 | |||
| JPS58501623A | 1983-09-29 | |||
| JP6253206B2 | 2017-12-27 | |||
| JPH11504574A | 1999-04-27 |
Foreign References:
| WO2015029987A1 | 2015-03-05 |
Attorney, Agent or Firm:
Kenzo Matsuura