Title:
ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2019029580
Kind Code:
A
Abstract:
To provide an electronic apparatus that inhibits an increase in manufacturing cost and requires a small space for connection between a conductive cable and wiring.SOLUTION: An electronic apparatus 1 comprises a resin molding 10 and a conductive cable 31 including an electric wire 32. One end 35 of the conductive cable 31 is embedded in the resin molding 10. A surface of the resin molding 10 includes a surface 11 that exposes an end face 34 of the conductive cable 31 on the one end 35 side and continues to the end face 34. The electronic apparatus 1 further includes a wire 40 that is formed on the end face 34 and surface 11 to be connected to an electric wire 32 inside the end face 34.SELECTED DRAWING: Figure 2
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Inventors:
KAWAI WAKAHIRO
Application Number:
JP2017149950A
Publication Date:
February 21, 2019
Filing Date:
August 02, 2017
Export Citation:
Assignee:
OMRON TATEISI ELECTRONICS CO
International Classes:
H05K3/32; H05K3/00
Domestic Patent References:
| JP2009295945A | 2009-12-17 | |||
| JP2010272756A | 2010-12-02 | |||
| JP2013207141A | 2013-10-07 |
Foreign References:
| US20080067637A1 | 2008-03-20 |
Attorney, Agent or Firm:
Fukami patent office