Title:
SILVER POWDER MIXTURE, MANUFACTURING METHOD THEREFOR, AND CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JP2019060017
Kind Code:
A
Abstract:
To provide a silver powder mixture suitable for forming a conductive membrane on a surface of a member with elasticity, a manufacturing method therefor, and a conductive paste using the silver powder mixture.SOLUTION: By adding a reductant consisting of one or more kinds of L-ascorbic acid, erythorbic acid, and a salt thereof after maintaining a solution in which one or two kind of a salt of copper and aluminum, and ethylene diamine tetraacetic acid to a silver nitrate solution for 60 sec., a silver powder mixture in which a filamentous silver powder consisting of a spherical part and a filamentous part, and a flake shaped silver powder having average particle diameter of 1 μm to 50 μm, and an aspect ratio defined as a ratio between average longer diameter and average thickness of 1.5 or more are mixed at a prescribed ratio.SELECTED DRAWING: Figure 1
Inventors:
SASAKI GENTA
OKANO TAKU
MOGI NORIO
SAITO YU
OKANO TAKU
MOGI NORIO
SAITO YU
Application Number:
JP2018174381A
Publication Date:
April 18, 2019
Filing Date:
September 19, 2018
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F1/05; B22F1/068; B22F9/24; H01B1/22; B22F1/065
Domestic Patent References:
| JP2015065098A | 2015-04-09 | |||
| JP2013513220A | 2013-04-18 | |||
| JP2010153364A | 2010-07-08 |
Foreign References:
| WO2015083421A1 | 2015-06-11 |
Attorney, Agent or Firm:
Komatsu Taka