Title:
UNDERLAYER COATING COMPOSITIONS FOR USE WITH PHOTORESISTS
Document Type and Number:
Japanese Patent JP2019082681
Kind Code:
A
Abstract:
To provide underlayer coating compositions particularly useful for imaging with EUV, wherein, thin underlayer or bottom organic coating layers used with overcoating photoresists can spontaneously dewet during post-application thermal treatment which can result in unacceptable pinhole defects, which can become more prevalent as the thickness of the layer decreases.SOLUTION: Underlayer coating compositions are provided that comprise a resin and a solvent component comprising one or more solvents having a boiling of 200°C or greater.SELECTED DRAWING: Figure 1
Inventors:
JUNG KYU JO
JAE HWAN SIM
JAE HWAN SIM
Application Number:
JP2018194101A
Publication Date:
May 30, 2019
Filing Date:
October 15, 2018
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT KOREA LTD
International Classes:
G03F7/11
Domestic Patent References:
| JP2017187764A | 2017-10-12 | |||
| JP2008275912A | 2008-11-13 | |||
| JP2018092170A | 2018-06-14 | |||
| JP2017155261A | 2017-09-07 |
Foreign References:
| WO2017145717A1 | 2017-08-31 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office