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Title:
OUTER PACKAGING MATERIAL FOR VACUUM HEAT INSULATION MATERIAL, VACUUM HEAT INSULATION MATERIAL, AND ARTICLE WITH VACUUM HEAT INSULATION MATERIAL
Document Type and Number:
Japanese Patent JP2019095065
Kind Code:
A
Abstract:
To provide an outer packaging material for a vacuum heat insulation material or the like capable of forming a vacuum heat insulation material that can keep heat insulation properties over a long period even in a high-temperature and high-humidity environment.SOLUTION: An outer packaging material for a vacuum heat insulation material 10A at least comprises a first film 1, a second film 2, a third film 3, and a thermally weldable film 4 in this order. The first film has a first resin substrate 5, and a metallic oxide phosphoric acid layer 6 disposed on at least one side of the first resin substrate and having at least an M-O-P bond (where M represents a metal atom, O represents an oxygen atom, and P represents a phosphorus atom). The second film has a second resin substrate 7, and an inorganic layer 8a disposed on at least one side of the second resin substrate. The third film has a third resin substrate 9, and an inorganic layer 8b disposed on at least one side of the third resin substrate.SELECTED DRAWING: Figure 1

Inventors:
MUNETA TAKU
IMAI MASAHIRO
Application Number:
JP2019010340A
Publication Date:
June 20, 2019
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
F16L59/065; B32B9/00; B32B9/04; B32B27/06; B65D65/40; F16L59/02
Domestic Patent References:
JP2011058537A2011-03-24
JP4961054B22012-06-27
JP2012077864A2012-04-19
Foreign References:
WO2013051287A12013-04-11
WO2016002222A12016-01-07
Attorney, Agent or Firm:
Akihiko Yamashita
Kishimoto Tatsuto