Title:
HOLE FORMING METHOD AND HOLE FORMING APPARATUS
Document Type and Number:
Japanese Patent JP2019102690
Kind Code:
A
Abstract:
To provide a hole forming method and a hole forming apparatus capable of stably forming a single nanopore in a film.SOLUTION: The hole forming method of forming a hole in a film includes a first step of applying a first voltage between a first electrode and a second electrode disposed across the film provided in an electrolytic solution, stopping application of the first voltage when a current flowing between the first electrode and the second electrode reaches a first threshold current, and forming a thin film portion on a part of the film, and a second step of applying a second voltage between the first electrode and the second electrode after the first step to form nanopores in the thin film portion.SELECTED DRAWING: Figure 1
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Inventors:
YANAGI ITARU
Application Number:
JP2017233344A
Publication Date:
June 24, 2019
Filing Date:
December 05, 2017
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
G01N27/00; H01L21/3063
Domestic Patent References:
| JP2015525114A | 2015-09-03 | |||
| JP2018187626A | 2018-11-29 |
Foreign References:
| WO2015097765A1 | 2015-07-02 | |||
| WO2016142925A1 | 2016-09-15 |
Attorney, Agent or Firm:
Hiraki International Patent Office