Title:
PROTECTIVE FILM FORMING METHOD
Document Type and Number:
Japanese Patent JP2019102807
Kind Code:
A
Abstract:
To provide a protective film forming method capable of adjusting a shape of a protective film and making the protective film grow thick upward.SOLUTION: In a protective film forming method, a plurality of recessed shapes is formed on a surface of a substrate, and a protective film is formed on a surface of a flat region between the plurality of adjacent recessed shapes. The protective film forming method includes: an upward growth process for growing upward an oxide film of organic metal or organic semi-metal on the surface of the flat region; and an etching process for etching a lateral portion of the oxide film of the organic metal or the organic semi-metal, to remove the oxide film of the organic metal or the organic semi-meta grown in a lateral direction.SELECTED DRAWING: Figure 11
Inventors:
TSUKAZAWA SHOGO
XIAO ZHI XIANG
ISHIDA MASAFUMI
TAKAHASHI YUTAKA
ENDO ATSUSHI
XIAO ZHI XIANG
ISHIDA MASAFUMI
TAKAHASHI YUTAKA
ENDO ATSUSHI
Application Number:
JP2018215571A
Publication Date:
June 24, 2019
Filing Date:
November 16, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/316; C23C16/04; C23C16/56; H01L21/3065; H01L21/31; H01L21/312
Domestic Patent References:
| JP2017120884A | 2017-07-06 | |||
| JP2016082096A | 2016-05-16 | |||
| JP2002208629A | 2002-07-26 | |||
| JP2013135154A | 2013-07-08 | |||
| JP2011101017A | 2011-05-19 | |||
| JP2014120584A | 2014-06-30 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki