Title:
RESIST UNDERLAY FILM-FORMING COMPOSITION, AND LITHOGRAPHY UNDERLAY FILM AND PATTERNING METHOD USING THE SAME
Document Type and Number:
Japanese Patent JP2019113571
Kind Code:
A
Abstract:
To provide a resist underlay film-forming composition having excellent pattern rectangularity, a lithography underlay film, and a patterning method.SOLUTION: A resist underlay film-forming composition contains a compound containing tellurium or a resin containing tellurium, and a silicon-containing compound.SELECTED DRAWING: None
Inventors:
TOIDA TAKUMI
MAKINOSHIMA TAKASHI
SATO TAKASHI
ECHIGO MASATOSHI
MAKINOSHIMA TAKASHI
SATO TAKASHI
ECHIGO MASATOSHI
Application Number:
JP2016091788A
Publication Date:
July 11, 2019
Filing Date:
April 28, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
G03F7/11; C08G79/00; G03F7/20; G03F7/26
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito