Title:
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2019114575
Kind Code:
A
Abstract:
To provide a semiconductor device capable of improving reliability.SOLUTION: A semiconductor device of an embodiment comprises: a semiconductor chip having a semiconductor layer and an electrode provided on the semiconductor layer; and a bonding wire connected to the electrode. The electrode has a copper-containing first metal layer, an aluminum-containing second metal layer provided between the first metal layer and the semiconductor layer, and a third metal layer which is provided between the first metal layer and the second metal layer and composed of a material different from that of the first metal layer and the second metal layer, in which a thickness of the first metal layer is thicker than each thickness of the second metal layer and the third metal layer.SELECTED DRAWING: Figure 2
Inventors:
KAWASHIRO FUMIYOSHI
Application Number:
JP2017244341A
Publication Date:
July 11, 2019
Filing Date:
December 20, 2017
Export Citation:
Assignee:
TOSHIBA CORP
TOSHIBA ELECTRONIC DEVICES & STORAGE CORP
TOSHIBA ELECTRONIC DEVICES & STORAGE CORP
International Classes:
H01L21/60; H01L21/3205; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Tetsuma Ikegami
Akira Sudo
Mitsuyuki Matsuyama
Akira Sudo
Mitsuyuki Matsuyama