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Title:
PULSE POWER SUPPLY DEVICE
Document Type and Number:
Japanese Patent JP2019115136
Kind Code:
A
Abstract:
To reduce stray capacitance while securing favorable cooling of a discrete type semiconductor switching device 6 and a resistor 8.SOLUTION: A pulse power supply device comprises: a copper heat sink 1 having cooling water piping 4 on a lower face; and a first and a second ceramic plates 2, 3 made of aluminium nitride having excellent insulation property and thermal conductivity. A plurality of semiconductor switching devices 6 are attached on an upper face of the first ceramic plate 2 in line. A plurality of resistors 8 are attached on an upper face of the second ceramic plate 3 in line. Respective ceramic plates 2 and 3 are fixed onto the heat sink 1 by a pair of aluminium support bars 14. Since the switching devices 6 and the resistors 8 are located and separated horizontally, stray capacitance therebetween and the stray capacitance between them and the heat sink 1 become small. Heat is transmitted to cooling water via the first and a second ceramic plates 2, 3, support bars 14, and the heat sink 1.SELECTED DRAWING: Figure 1

Inventors:
OSADA TOSHIHIRO
AZUMA MASAO
Application Number:
JP2017245852A
Publication Date:
July 11, 2019
Filing Date:
December 22, 2017
Export Citation:
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Assignee:
MEIDENSHA ELECTRIC MFG CO LTD
International Classes:
H02M9/04
Domestic Patent References:
JP2002134818A2002-05-10
JP2001313496A2001-11-09
JP2016039157A2016-03-22
JP2007300732A2007-11-15
Attorney, Agent or Firm:
Hiromichi Kobayashi
Tomioka Kiyoshi
Uzawa Hidehisa
Tomoyuki Ota



 
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