Title:
SEMICONDUCTOR LIGHT EMITTING DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2019129184
Kind Code:
A
Abstract:
To easily detect the positional deviation of a semiconductor light emitting element included in a semiconductor light emitting device.SOLUTION: The arrangement positions of a first electrode 3 and a second electrode 4 formed on one side of a package substrate 2 and a semiconductor chip 5 having electrical continuity with the first electrode 3 and the second electrode 4 are determined to be the position at which a first line segment including at least two line segments set on an edge of the semiconductor chip 5 and not parallel to each other and a second line segment including at least two line segments set on a boundary between portions where the first electrode 3 or the second electrode is formed and not formed and not parallel to each other are parallel or almost parallel in a plan view and the distance between these is a prescribed distance, and at which the first line segment and the portion where the first electrode 3 or the second electrode 4 is not formed overlap and the second line segment and the semiconductor chip 5 do not overlap in a plan view. A positional deviation of the semiconductor chip 5 from the package substrate 2 is detected on the basis of the relative physical relationship of the first and the second line segments.SELECTED DRAWING: Figure 1
More Like This:
Inventors:
KITAMURA TAKESHI
WAN YUTING
WAN YUTING
Application Number:
JP2018008225A
Publication Date:
August 01, 2019
Filing Date:
January 22, 2018
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
H01L21/60; H01L33/00
Attorney, Agent or Firm:
Tetsuya Mori
Hide Tanaka Tetsu
Hide Tanaka Tetsu