Title:
METHOD FOR FORMING WIRING PATTERN ON GLASS SUBSTRATE
Document Type and Number:
Japanese Patent JP2019129247
Kind Code:
A
Abstract:
To provide a technique for forming a wiring pattern on a glass substrate, the technique allowing the formation of a wiring pattern on a glass substrate without damaging a glass substrate even if the conditions of the laser irradiation are not adjusted accurately.SOLUTION: The method for forming a wiring pattern 3 on a glass substrate 1 includes the steps of: reducing the thickness of a metal coating film 2 in a site 2b by irradiating the site 2b, which is the site other than the region 2a where the wiring pattern of the metal coating film 2 on the surface of the glass substrate 1 is formed, with a laser; and exposing a glass substrate 1 by removing the metal coating film 2 remaining in the site 2b by etching with a metal etchant to form a wiring pattern 3 with a predetermined pattern formation.SELECTED DRAWING: Figure 1
Inventors:
WATANABE MITSUHIRO
HONMA HIDEO
HONMA HIDEO
Application Number:
JP2018010450A
Publication Date:
August 01, 2019
Filing Date:
January 25, 2018
Export Citation:
Assignee:
KANTO GAKUIN
International Classes:
H05K3/08; B23K26/351
Attorney, Agent or Firm:
Katsuhiro Yoshimura
Hiroko Negishi
Kayo Ono
Hiroko Negishi
Kayo Ono