Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
Japanese Patent JP2019176125
Kind Code:
A
Abstract:
To recover SPM having high concentration of sulfuric acid while efficiently removing a resist from a substrate.SOLUTION: A first SPM, prepared by mixing sulfuric acid and hydrogen peroxide water at a first mixing ratio, is supplied to a substrate. A second SPM, prepared by mixing the sulfuric acid and the hydrogen peroxide water at a second mixing ratio greater than the first mixing ratio, is supplied to the substrate after the supply of the first SPM is stopped. The first SPM expelled from the substrate is made to flow into a drain piping. The second SPM expelled from the substrate is made to flow into a recovery piping. SPM is prepared by mixing hydrogen peroxide water with the sulfuric acid included in the second SPM guided by the recovery piping.SELECTED DRAWING: Figure 6
Inventors:
SHIBAYAMA NOBUYUKI
HAYASHI MASAYUKI
ENDO TORU
HAYASHI MASAYUKI
ENDO TORU
Application Number:
JP2018206627A
Publication Date:
October 10, 2019
Filing Date:
November 01, 2018
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD
International Classes:
H01L21/304
Domestic Patent References:
| JP2013207080A | 2013-10-07 | |||
| JP2012195524A | 2012-10-11 | |||
| JP2018018899A | 2018-02-01 | |||
| JP2015109335A | 2015-06-11 | |||
| JP2015082650A | 2015-04-27 | |||
| JP2008235341A | 2008-10-02 | |||
| JP2008028280A | 2008-02-07 |
Foreign References:
| WO2017135064A1 | 2017-08-10 |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office