MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

Japanese Patent JP2019176127

A

To provide a multilayer ceramic electronic component achieving both of humidity resistance and high capacity, and a manufacturing method thereof.SOLUTION: A multilayer ceramic electronic component includes a ceramic element assembly. The ceramic element assembly includes: a lamination body; and a side margin part. The lamination body includes: a capacitance formation part having a plurality of ceramic layers laminated in a first direction and a plurality of inner electrodes arranged between the plurality of ceramic layers; a side surface oriented in a second direction orthogonal to a first direction; an end surface oriented in a third direction orthogonal to the first and second directions; and a lead-out part which is extended in the third direction from the capacitance formation part, and from which the inner electrodes are led-out; and a cover part covering the capacitance formation part and the lead-out part from the first direction and having a thickness of less than 20 μm. The side margin part has a thickness of less than 20 μm, and covers the side surface of the lamination body. The lead-out part includes a first region arranged at a central part of the first direction, and a second region arranged between the cover part and the first region, and of which the end part in the second direction of the inner electrode is positioned at an inner side of the second direction from that of the first region.SELECTED DRAWING: Figure 8

NAKAMURA TOMOAKI
TAWARA MIKIO
MORITA KOICHIRO
FUKUOKA TETSUHIKO
KUSUMOTO MASASHI

JP2018231086A

October 10, 2019

December 10, 2018

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TAIYO YUDEN KK

H01G4/30

JP2001155958A	2001-06-08
JP2016181597A	2016-10-13
JPH0732936U	1995-06-16
JPH11297566A	1999-10-29

Junichi Omori
Masayoshi Sekine

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