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Patent Searching and Data


Title:
COOLING APPARATUS AND ELECTRONIC EQUIPMENT
Document Type and Number:
Japanese Patent JP2019201165
Kind Code:
A
Abstract:
To disclose a technique that is directed as one aspect to improvement of heat radiation efficiency of a plurality of heat radiation fins.SOLUTION: A cooling apparatus 10 comprises a heat receiving base part 22, a fin base part 24, a heat conduction part 30, and heat radiation fins 40. Heat is transferred to the heat receiving base part 22 from an electronic component 12. The fin base part 24 faces the heat receiving base part 22 and also forms a ventilation flue 26 where cooling air V flows with the heat receiving base part 22. The heat conduction part 30 connects the heat receiving base part 22 and fin base part 24 to each other. The plurality of heat radiation fins 40 extend from the fin base part 24 to an opposite side from the heat receiving base part 22. Further, the fin base part 24 has a plurality of blowout holes 28 individually communicating with gaps 42 between adjacent heat radiation fins 40.SELECTED DRAWING: Figure 2

Inventors:
SATO YOICHI
Application Number:
JP2018096033A
Publication Date:
November 21, 2019
Filing Date:
May 18, 2018
Export Citation:
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Assignee:
FUJITSU LTD
International Classes:
H01L23/467; G06F1/20; H05K7/20
Domestic Patent References:
JPH08267214A1996-10-15
Foreign References:
US20140151010A12014-06-05
US20170352605A12017-12-07
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Hiroshi Fukuda