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Title:
RESIST COMPOSITION AND RESIST PATTERN FORMING METHOD
Document Type and Number:
Japanese Patent JP2019207301
Kind Code:
A
Abstract:
To provide a resist composition which further reduces roughness and is capable of improving rectangularity of a cross-sectional shape of a resist pattern, and a resist pattern forming method using the resist composition.SOLUTION: The resist composition contains: a compound (BD1) represented by general formula (bd1) and comprising an anionic moiety and a cationic moiety; and an organic solvent (S1) having a hydroxyl group. In the formula (bd1), Rx-Rxeach represent a hydrocarbon group or a hydrogen atom or may be bonded to each other to form a ring structure; Ry-Ryeach represent a hydrocarbon group or a hydrogen atom or may be bonded to each other to form a ring structure; Rz-Rzeach represent a hydrocarbon group or a hydrogen atom or may be bonded to each other to form a ring structure; at least one of Rx-Rx, Ry-Ryand Rz-Rzhas an anionic group; and Mrepresents an organic cation.SELECTED DRAWING: None

Inventors:
MAEBASHI TAKAYA
KOMURO YOSHITAKA
Application Number:
JP2018101879A
Publication Date:
December 05, 2019
Filing Date:
May 28, 2018
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/004; C07C309/06; C07C309/12; C07C309/17; C07C381/12; C09K3/00; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
JP2012098390A2012-05-24
Attorney, Agent or Firm:
Sumio Tanai
Matsumoto
Ryu Miyamoto
Masato Iida