Title:
THROUGH-HOLE FILLING METHOD AND APPARATUS USED THEREFOR
Document Type and Number:
Japanese Patent JP2020000955
Kind Code:
A
Abstract:
To provide a through-hole filling method for reliably filling a through-hole formed on a film with a coating material, and an apparatus used therefor.SOLUTION: A method for filling a through-hole in a coating object region with a coating material by an ink jet system includes processes of: acquiring an image in a coating object region by a plurality of line scan cameras arranged in a gantry part while moving the gantry part in one direction in a plane view; calculating coordinates of the through-hole from the image in the coating object region; and filling the through-hole with the coating material by discharging the coating material from at least one nozzle which is arranged in the gantry part and is configured to change the position based on the coordinates while moving the gantry part in a direction opposite from the direction in acquiring the image in the coating object region.SELECTED DRAWING: Figure 1
Inventors:
TSUJII HIROSHI
MASAKI SHIGETO
KISEN SEIJI
MASAKI SHIGETO
KISEN SEIJI
Application Number:
JP2018119872A
Publication Date:
January 09, 2020
Filing Date:
June 25, 2018
Export Citation:
Assignee:
NISSHA CO LTD
International Classes:
B05D1/26; B05C5/00; B05C11/00; B05C11/10; B05D7/00; B41J2/01