Title:
PRESSURE SENSOR
Document Type and Number:
Japanese Patent JP2020012697
Kind Code:
A
Abstract:
To provide a pressure sensor with which it is possible to reduce the temperature rise of a pressure detection element mounted on the surface of a diaphragm part.SOLUTION: A diaphragm body 140 includes a diaphragm part 144 in which a pressure detection element 150 is mounted, a first connection part 141 for connecting the diaphragm body 140 to a displacement member 130, a second connection part 145 for connecting the diaphragm body 140 to a housing 100, a first coupling part 142 for coupling a portion located radially inward of the diaphragm part 144 and the first connection part 141, and a second coupling part 143 for coupling a portion located radially outward of the diaphragm part 144 and the second connection part 145. The maximum thickness T1 of the first coupling part 142 and the minimum thickness T2 of the second coupling part 143 satisfies the formula T1
Inventors:
SASA SHIKO
Application Number:
JP2018134192A
Publication Date:
January 23, 2020
Filing Date:
July 17, 2018
Export Citation:
Assignee:
NGK SPARK PLUG CO
International Classes:
G01L19/06; G01L23/22
Attorney, Agent or Firm:
Cosmos International Patent and Trademark Office