Title:
BUS BAR ASSEMBLY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2020035824
Kind Code:
A
Abstract:
To provide a bus bar assembly which can miniaturize in the vertical direction while securing electrical isolation among a plurality of bus bars, with a low-cost damming structure of a sealing resin of a semiconductor element such as an LED to be mounted.SOLUTION: The bus bar assembly includes: a plurality of bus bars arranged in parallel in the same plane with the provision of a gap; and an insulating resin layer which includes a connector unit filled into the gap to connect a plurality of bus bars in an insulation state, and a first surface side lamination part provided on a first surface of a bus bar connection body composed of the plurality of bus bars connected by the connector unit. The insulating resin layer includes: a center opening on the first surface side to expose the first surface of the plurality of bus bars; a central coating region on the first surface side which surrounds the center opening on the first surface side; a peripheral edge opening on the first surface side which exposes the first surface of the bus bar connection body in a region which surrounds the central coating region on the first surface side; and a peripheral edge coating region on the first surface side which surrounds the peripheral edge opening on the first surface side.SELECTED DRAWING: Figure 6
More Like This:
Inventors:
TATSUMI SHOTA
Application Number:
JP2018159390A
Publication Date:
March 05, 2020
Filing Date:
August 28, 2018
Export Citation:
Assignee:
SUNCALL CORP
International Classes:
H01L23/14; H01L33/52; H01L33/62
Domestic Patent References:
| JP2018029183A | 2018-02-22 | |||
| JP2017220684A | 2017-12-14 | |||
| JP2013135077A | 2013-07-08 |
Attorney, Agent or Firm:
Patent business corporation Arole International