Title:
CIRCUIT BOARD, ELECTRONIC COMPONENT AND ELECTRONIC MODULE
Document Type and Number:
Japanese Patent JP2020035825
Kind Code:
A
Abstract:
To provide a circuit board, an electronic component, and the like, in which connection strength of surface conductor is high.SOLUTION: A circuit board 100 includes an insulation board 1 composed of ceramic, a circuit conductor 2 including multiple surface conductors 21 provided on the first face 11 of the insulation board 1, and a ceramic layer 3 having an overlap part 31 overlapping at least a part of a first surface conductor 21a, at a position close to the felly of the first face 11 of the insulation board 1, out of the surface conductors 21, and extending from the overlap part 31 onto the first face 11 of the insulation board 1. The overlap part 31 of the ceramic layer 3 is a portion of the lateral face of the first surface conductor 21a entering inward from a portion on the outer edge side of the first face 11 of the insulation board 1.SELECTED DRAWING: Figure 1
Inventors:
KUMAMOTO TAKEYUKI
Application Number:
JP2018159436A
Publication Date:
March 05, 2020
Filing Date:
August 28, 2018
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H01L23/12; H01L23/13; H05K1/02