Title:
TERMINAL, CONNECTOR FOR BOARD, BOARD WITH CONNECTOR, AND MANUFACTURING METHOD OF TERMINAL
Document Type and Number:
Japanese Patent JP2020038767
Kind Code:
A
Abstract:
To provide a terminal capable of reducing cost while maintaining wettability of a solder.SOLUTION: A terminal comprises a board connection part which is connected to a circuit board. The terminal comprises a substrate and a plating layer. The substrate includes a plated surface which is covered by the plating layer, and an exposed surface which is exposed. In the board connection part, the plating layer includes a first inclined plane which covers a slope connecting the plated surface and the exposed surface.SELECTED DRAWING: Figure 9
Inventors:
NAKANISHI YUICHI
MATSUDA HIDEKAZU
SAKAI HIROTO
MATSUDA HIDEKAZU
SAKAI HIROTO
Application Number:
JP2018164559A
Publication Date:
March 12, 2020
Filing Date:
September 03, 2018
Export Citation:
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H01R12/57; H01R12/71; H01R13/03; H01R13/04
Domestic Patent References:
| JPH0714569U | 1995-03-10 | |||
| JP2002505513A | 2002-02-19 | |||
| JPH09246450A | 1997-09-19 | |||
| JP2015060815A | 2015-03-30 |
Attorney, Agent or Firm:
Akatsuki Joint Patent Office