Title:
HEAT DISSIPATION MODULE AND PROJECTION DEVICE
Document Type and Number:
Japanese Patent JP2020042264
Kind Code:
A
Abstract:
To provide a heat dissipation module and a projection device having the same.SOLUTION: A heat dissipation module disclosed herein includes a heat pipe, a heat dissipation plate, a first dissipation fin, and a second heat dissipation fin, where the heat pipe comprises a first portion, a second portion, and a third portion connected with the first and second portions, the first portion being disposed in parallel with the second portion. The third portion of the heat pipe and multiple heating elements are connected to the heat dissipation plate. The first portion of the heat pipe passes through the first heat dissipation fin and the second portion of the heat pipe passes through the second heat dissipation fin. The heat generated by the heating elements is dissipated by the heat dissipation plate and the first and second heat dissipation fins through thermal conduction and thermal convection.SELECTED DRAWING: Figure 2
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Inventors:
ZHONG WEN YAN
LAI YI HAN
LAI YI HAN
Application Number:
JP2019161645A
Publication Date:
March 19, 2020
Filing Date:
September 05, 2019
Export Citation:
Assignee:
CTX OPTO ELECTRONICS CORP
International Classes:
G03B21/16; G03B21/00; H04N5/74; H04N9/31; H05K7/20
Domestic Patent References:
| JP2013025212A | 2013-02-04 | |||
| JP2017033779A | 2017-02-09 | |||
| JP2007133300A | 2007-05-31 | |||
| JPS5784989A | 1982-05-27 | |||
| JP2015185551A | 2015-10-22 | |||
| JP2008058626A | 2008-03-13 |
Foreign References:
| US20110019161A1 | 2011-01-27 | |||
| WO2015015552A1 | 2015-02-05 | |||
| US20070211477A1 | 2007-09-13 | |||
| US20100053567A1 | 2010-03-04 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki
Tadahiko Ito
Shinsuke Onuki