Title:
PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2020080352
Kind Code:
A
Abstract:
To provide a printed wiring board with a highly reliable and high-density conductor layer.SOLUTION: In a printed wiring board 10, the upper surface 34Fu of a first conductor layer 34F is exposed and the surface is flattened by a first resin insulating layer 50F having no core material that fills the side surface 34Fs, and a second resin insulating layer 150F having a core material is provided on the first resin insulating layer 50F, and therefore, the surface of the second resin insulating layer 150F has high flatness, and a third resin insulating layer 250F formed on the second resin insulating layer 150F and having no core material has high flatness. Therefore, the high reliability can be provided even when the high density third conductor layer 258F is formed on the third resin insulating layer 250F.SELECTED DRAWING: Figure 1
Inventors:
ISHIHARA TERUYUKI
Application Number:
JP2018212333A
Publication Date:
May 28, 2020
Filing Date:
November 12, 2018
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46
Attorney, Agent or Firm:
Akito Tashita