Title:
PLASMA ETCHING APPARATUS
Document Type and Number:
Japanese Patent JP2020088203
Kind Code:
A
Abstract:
To provide a plasma etching device capable of understanding attraction state of a workpiece easily.SOLUTION: A plasma etching device includes an electrostatic attraction table 10 for electrostatically attracting a workpiece to a holding surface 11, a gas supply unit for supplying plasmatized process gas to the workpiece, a chamber having an opening for carrying in and out the workpiece, a decompression unit for decompressing the chamber, a transfer unit 60 for holding the workpiece by means of a carrier pad 61 and carrying-in to and carrying-out from the electrostatic attraction table 10 of the chamber, and an electrification inspection unit 70 for inspecting the electrification state of the holding surface 11. The electrification inspection unit 70 includes a surface potential meter 71 attached to the carrier pad and measuring the electrification amount of an opposing holding surface 11, a comparator for comparing a measured value of the surface potential meter 71 and a preset allowable range of the electrification amount, and a notification part for notifying of the fact that the measured value is out of tolerance.SELECTED DRAWING: Figure 2
Inventors:
YOKOO SUSUMU
NISHIDA YOSHITERU
IIDA HIDEKAZU
SENDO KENTA
NISHIDA YOSHITERU
IIDA HIDEKAZU
SENDO KENTA
Application Number:
JP2018221576A
Publication Date:
June 04, 2020
Filing Date:
November 27, 2018
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/3065; H01L21/683
Domestic Patent References:
| JP2018014383A | 2018-01-25 | |||
| JP2004087576A | 2004-03-18 | |||
| JP2007311462A | 2007-11-29 |
Foreign References:
| WO2018154706A1 | 2018-08-30 |
Attorney, Agent or Firm:
Sakai International Patent Office