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Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2020090570
Kind Code:
A
Abstract:
To provide a resin composition that makes it possible to obtain a cured product having a low linear thermal expansion coefficient in Z direction (i.e. the thickness direction when a laminar cured product is obtained) and excellent flexibility.SOLUTION: A resin composition contains (A) an epoxy resin, (B) a curing agent, and (C) a polyimide resin, the (B) component containing (B-1) a maleimide compound having three or more functionalities.SELECTED DRAWING: None

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Inventors:
TSURUI KAZUHIKO
Application Number:
JP2018226770A
Publication Date:
June 11, 2020
Filing Date:
December 03, 2018
Export Citation:
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Assignee:
AJINOMOTO KK
International Classes:
C08G59/40; B32B7/025; B32B27/34; B32B27/38; C08L63/00; C08L79/08; H05K1/03
Domestic Patent References:
JPH0488021A1992-03-19
JP2016196557A2016-11-24
JPH06256472A1994-09-13
JPH06345964A1994-12-20
JP2017119361A2017-07-06
JP2017210527A2017-11-30
JPH05339344A1993-12-21
JPH0339311A1991-02-20
JP2018139334A2018-09-06
Foreign References:
US20150353730A12015-12-10
WO2018062405A12018-04-05
WO2010128667A12010-11-11
Attorney, Agent or Firm:
Sakai International Patent Office



 
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