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Title:
REINFORCING RESIN COMPOSITION, ELECTRONIC COMPONENT, ELECTRONIC COMPONENT MANUFACTURING METHOD, MOUNTING STRUCTURE, AND MOUNTING STRUCTURE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2020090569
Kind Code:
A
Abstract:
To provide a reinforcing resin composition that prevents defective conduction from occurring between a bump and a conductor, and readily covers a joint between the conductor and the bump.SOLUTION: This reinforcing thermosetting resin composition contains: an epoxy resin (A); a phenol resin (B); and a benzoxazine compound (C).SELECTED DRAWING: Figure 2

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Inventors:
YAMATSU SHIGERU
SUZUKI YASUHIRO
HINO HIROHISA
Application Number:
JP2018226757A
Publication Date:
June 11, 2020
Filing Date:
December 03, 2018
Export Citation:
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Assignee:
PANASONIC IP MAN CORP
International Classes:
C08G59/40; C08G59/56; C08G59/62; H01L23/12; H05K3/28
Domestic Patent References:
JP2006016576A2006-01-19
Foreign References:
WO2014203735A12014-12-24
WO2018216229A12018-11-29
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office



 
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