Title:
GUIDE DEVICE
Document Type and Number:
Japanese Patent JP2020131539
Kind Code:
A
Abstract:
To provide a guide device capable of absorbing axial center displacement and angle displacement between a workpiece and a mold upon the connection between the mold and the guide device.SOLUTION: A guide device for guiding a workpiece 60 to the inside of a mold comprises: a guide member having openings 4a and 4b on one end portion 2a and the other end portion 2b, respectively, and a first inner cavity 5 for guiding the workpiece 60; and a holding member 3 having a second inner cavity 71 for guiding at least a part of the guide member. The inner diameter of the opening 4b on the other end portion 2b being on the mold side is smaller than the inner diameter of the opening 4a on the one end portion 2a. The holding member 3 and the guide member are slidable to each other in the extension direction z2 of the second inner cavity 71. In addition, when the holding member 3 is in a predetermined position with respect to the guide member, a joint portion 72 of the guide member and a joint portion 73 of the holding member 3 are joined to each other to be fixed. When the holding member 3 is not in the predetermined position, a gap 70 is formed between the joint portion 72 of the guide member and the joint portion 73 of the holding member 3 in the second inner cavity 71.SELECTED DRAWING: Figure 4
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Inventors:
EDA TAKURO
Application Number:
JP2019027459A
Publication Date:
August 31, 2020
Filing Date:
February 19, 2019
Export Citation:
Assignee:
KANEKA CORP
International Classes:
B29C33/12; B29C31/00; B29C49/42
Attorney, Agent or Firm:
Asfi International Patent Office