Title:
SUPPLY DEVICE OF POLISHING LIQUID, SUPPLY METHOD, AND SUBSTRATE POLISHING METHOD
Document Type and Number:
Japanese Patent JP2020199600
Kind Code:
A
Abstract:
To provide a polishing liquid from which abrasive grains having high adhesiveness and a very small size and abrasive grains having a size that may cause scratches are removed.SOLUTION: According to one embodiment, a supply device is provided that is used to supply a polishing liquid containing abrasive grains to a polishing device. The supply device has: a reservoir for retaining the polishing liquid; a first passage for sending the polishing liquid from the reservoir to the polishing device; a first filter device which is disposed in the first passage and removes abrasive grains having a particle size that is equal to or larger than a first size; and a second filter device which is disposed in the first passage and removes abrasive grains having a particle size that is a second size or smaller.SELECTED DRAWING: Figure 1
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Inventors:
FUKUNAGA AKIRA
TSUJIMURA MANABU
TSUJIMURA MANABU
Application Number:
JP2019108632A
Publication Date:
December 17, 2020
Filing Date:
June 11, 2019
Export Citation:
Assignee:
EBARA CORP
International Classes:
B24B57/02; B01D61/14; B01D61/58; B01D69/02; B24B37/00; H01L21/304
Domestic Patent References:
JP2012521896A | 2012-09-20 | |||
JP2009113148A | 2009-05-28 | |||
JP2009290139A | 2009-12-10 | |||
JP2018144014A | 2018-09-20 | |||
JP2009147278A | 2009-07-02 | |||
JP2002069495A | 2002-03-08 | |||
JP2007073686A | 2007-03-22 |
Foreign References:
WO2002035593A1 | 2002-05-02 | |||
US6551174B1 | 2003-04-22 |
Attorney, Agent or Firm:
Shinjiro Ono
Toru Miyamae
Yukio Kanegae
Makoto Watanabe
Toru Miyamae
Yukio Kanegae
Makoto Watanabe