Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CONNECTOR
Document Type and Number:
Japanese Patent JP2021005478
Kind Code:
A
Abstract:
To suppress the occurrence of a sink mark and a void in a sealing groove.SOLUTION: A connector 20 includes terminals 31 and 32, a primary mold portion 40 that holds the terminals 31 and 32, and a secondary mold portion 50 that holds the primary mold portion 40, and a sealing groove 54 is formed in the secondary mold portion 50, and a protrusion 40P is formed in the primary mold portion 40 at a position corresponding to the sealing groove 54.SELECTED DRAWING: Figure 4

Inventors:
YAMADA HIROTAKA
Application Number:
JP2019118153A
Publication Date:
January 14, 2021
Filing Date:
June 26, 2019
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO WIRING SYSTEMS
International Classes:
H01R13/405
Domestic Patent References:
JP2019015745A2019-01-31
JP2020123539A2020-08-13
JPH1187011A1999-03-30
JP2019093634A2019-06-20
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita