Title:
VIBRATION DISTRIBUTION JOINT TREATMENT TAPE
Document Type and Number:
Japanese Patent JP2021042649
Kind Code:
A
Abstract:
To provide a joint treatment material for distributing and reducing force to be received causing load to be applied and a putty crack to occur at a coupling joint parts between boards by vibration as a dry type construction method turned to be major in a construction.SOLUTION: The construction method according to the invention arranges a surface fastener loop (6) at a side of a layer provided with a surface fastener hook (5) along a coupling joint at substrate board (1)(2) sides and a putty layer side and thus maintains the state where the surface fasteners (5)(6) having flexibility without buffering directly are engaged and interposed in an intermediate position between the substrate board side and the putty layer while a fiber tape had been adhered directly to the coupling joint part or a putty treatment has been performed and fixed directly to the joint part for making it smooth in the existing way.SELECTED DRAWING: Figure 2
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Inventors:
TAJIMA TAKASHI
Application Number:
JP2019181725A
Publication Date:
March 18, 2021
Filing Date:
September 11, 2019
Export Citation:
Assignee:
TAJIMA TAKASHI
International Classes:
E04F13/07; E04F13/08