Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021048185
Kind Code:
A
Abstract:
To provide a semiconductor device capable of maintaining fastening by a fastening part.SOLUTION: A semiconductor device 10 comprises: a metal radiator plate 20; a semiconductor module 31 provided onto the radiator plate 20; a resin case 60 being provided to the radiator plate 20 and fixed to the semiconductor module 31; and a plate spring 40 provided onto the semiconductor module 31. Also, the semiconductor device 10 comprises a pressing member 50. The pressing member 50 includes a fastening part 52 for being fastened with the radiator plate 20, and presses the plate spring 40 to the semiconductor module 31 by fastening the fastening part 52 and the radiator plate 20. The pressing member 50 positions a resin case 60 to the radiator plate 20, and the fastening part 52 and the radiator plate 20 are fastened without passing through the resin case 60.SELECTED DRAWING: Figure 6
Inventors:
MASUTANI MUNEHIKO
Application Number:
JP2019168650A
Publication Date:
March 25, 2021
Filing Date:
September 17, 2019
Export Citation:
Assignee:
TOYOTA IND CORP
International Classes:
H01L23/40
Domestic Patent References:
| JP2009043775A | 2009-02-26 | |||
| JP2014207266A | 2014-10-30 | |||
| JP2013026320A | 2013-02-04 |
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda