Title:
ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2021063220
Kind Code:
A
Abstract:
To provide an adhesive layer that has a sufficient ultraviolet absorbing ability even when reduced in thickness, reduces the occurrence of bleedout, and reduces the absorption of visible light around at a wavelength of 420 nm, and an adhesive composition for forming the adhesive layer.SOLUTION: An adhesive composition contains a resin (A), a light selection absorption compound (B) that shows a maximum absorption at a wavelength of 360 nm or more and satisfies following formulae (1) and (2), and at least one selected from a monomer (C-1) that has a polymerizable group in the molecule and shows a maximum absorption at a wavelength of 300 nm or more and less than 360 nm and a resin (C-2) that shows a maximum absorption at a wavelength of 300 nm or more and less than 360 nm. ε(380)≥25 (1). ε(380)/ε(420)≥20 (2). [In the formulae (1) and (2), ε(380) denotes a gram extinction coefficient of the light selection absorption compound (B) at a wavelength of 380 nm and ε(420) denotes a gram extinction coefficient of the light selection absorption compound (B) at a wavelength of 420 nm. The unit of the gram extinction coefficient is L/(g cm)].SELECTED DRAWING: None
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Inventors:
ASAZU YUJI
NISHIGAMI YUKI
KUMON KOJI
NISHIGAMI YUKI
KUMON KOJI
Application Number:
JP2020170404A
Publication Date:
April 22, 2021
Filing Date:
October 08, 2020
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C09J201/00; C09J4/02; C09J7/38; C09J11/06
Attorney, Agent or Firm:
Fukami patent office