Title:
SUBSTRATE MOUNTING METHOD, SUBSTRATE HOLDING DEVICE, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2021073373
Kind Code:
A
Abstract:
To provide a substrate mounting device which reduces variations in positions of substrates when mounting the substrates on a mounting body.SOLUTION: A substrate mounting device has support means containing a plurality of support tools 401-405 that support an edge of a substrate 10, and mounting means for mounting the substrate on a mounting body. For the plurality of support tools, a distance between some support tools is different from a distance between other support tools. Alternatively, the substrate mounting device has support means containing a plurality of support tools that support the edge of the substrate, support tool movement means that moves at least some of the plurality of support tools, independently of the other support tools, and mounting means for mounting the substrate on the mounting body.SELECTED DRAWING: Figure 4
Inventors:
ISHII HIROSHI
OTA AKIRA
KAMANO NAOYUKI
OTA AKIRA
KAMANO NAOYUKI
Application Number:
JP2021000598A
Publication Date:
May 13, 2021
Filing Date:
January 05, 2021
Export Citation:
Assignee:
CANON TOKKI CORP
International Classes:
C23C14/50; H01L21/683; H01L51/50; H05B33/10
Domestic Patent References:
| JP2005259948A | 2005-09-22 | |||
| JP2010084204A | 2010-04-15 | |||
| JP2006190950A | 2006-07-20 | |||
| JP2017066517A | 2017-04-06 |
Foreign References:
| WO2016199759A1 | 2016-12-15 |
Attorney, Agent or Firm:
Hidewa Patent Office