Title:
UNDERFILL MATERIAL, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JP2021119239
Kind Code:
A
Abstract:
To provide an underfill material that can suppress an increase in the thermal expansion coefficients of a cured product and reduce the viscosity during its filling, and a semiconductor package obtained by using the same and a method for producing the same.SOLUTION: An underfill material contains epoxy resin, a curing agent, and a filler, the epoxy resin including an epoxy compound having the structure of N,N-diglycidylaniline.SELECTED DRAWING: None
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| JPS6079079 | ADHESIVE COMPOSITION |
Inventors:
MASUDA TOMOYA
SHIRAKAMI MASASHI
SHIRAKAMI MASASHI
Application Number:
JP2021074144A
Publication Date:
August 12, 2021
Filing Date:
April 26, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
C08G59/28; C08G59/38; C08K3/013; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2010254955A | 2010-11-11 | |||
| JP2010132793A | 2010-06-17 | |||
| JP2009215518A | 2009-09-24 |
Attorney, Agent or Firm:
Patent Service Corporation Taiyo International Patent Office