Title:
【発明の名称】集積型半導体装置
Document Type and Number:
Japanese Patent JP2655594
Kind Code:
B2
More Like This:
Inventors:
OOHATA KEIICHI
Application Number:
JP217384A
Publication Date:
September 24, 1997
Filing Date:
January 10, 1984
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L29/812; H01L21/338; H01L21/8232; H01L21/8236; H01L27/06; H01L27/08; H01L27/088; H01L27/095; H01L29/778; H01L29/80; (IPC1-7): H01L21/06; H01L21/8232; H01L27/095
Domestic Patent References:
| JP58147169A | ||||
| JP58143587A | ||||
| JP59172272A | ||||
| JP59178776A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)