Title:
【発明の名称】相補型半導体集積回路装置
Document Type and Number:
Japanese Patent JP2655595
Kind Code:
B2
Inventors:
EGUCHI KOJI
Application Number:
JP22212385A
Publication Date:
September 24, 1997
Filing Date:
October 04, 1985
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/8238; H01L21/822; H01L21/8234; H01L27/04; H01L27/088; H01L27/092; (IPC1-7): H01L21/8238; H01L21/822; H01L27/04; H01L27/092
Domestic Patent References:
| JP51132976A | ||||
| JP5834985A | ||||
| JP5814562A | ||||
| JP59117148A | ||||
| JP593963A | ||||
| JP55105362A | ||||
| JP5843559A | ||||
| JP5432982A | ||||
| JP4924582A | ||||
| JP5558560A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)