Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2708156
Kind Code:
B2
Inventors:
Toshiro Hayakawa
Naohiro Suyama
Takahashi Kosei
Masafumi Kondo
Naohiro Suyama
Takahashi Kosei
Masafumi Kondo
Application Number:
JP18864587A
Publication Date:
February 04, 1998
Filing Date:
July 27, 1987
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01L21/20; H01L21/203; H01L21/26; (IPC1-7): H01L21/203; H01L21/20
Domestic Patent References:
| JP6288318A | ||||
| JP6148247B2 |
Attorney, Agent or Firm:
Umeda Masaru (2 outside)